Intel, SK hynix shares surge following reports of chip packaging partnership — SK is said to be testing Intel's 2.5D EMIB for HBM integration

www.tomshardware.com

Intel, SK hynix shares surge following reports of chip packaging partnership — SK is said to be testing Intel's 2.5D EMIB for HBM integration

www.tomshardware.com

Rekall Incorporated@piefed.socialM to

Hardware@lemmy.worldEnglish · 15 days ago

SK hynix is said to be testing Intel's 2.5D packaging for HBM integration.

SK hynix is said to be testing Intel’s 2.5D packaging for HBM integration.

You must log in or register to comment.

Chat

Hardware@lemmy.world

hardware@lemmy.world

Create a post

You are not logged in. However you can subscribe from another Fediverse account, for example Lemmy or Mastodon. To do this, paste the following into the search field of your instance: !hardware@lemmy.world

All things related to technology hardware, with a focus on computing hardware.

Some other hardware communities across Lemmy:

Rules (Click to Expand):

Follow the Lemmy.world Rules - https://mastodon.world/about
Be kind. No bullying, harassment, racism, sexism etc. against other users.
No Spam, illegal content, or NSFW content.
Please stay on topic, adjacent topics (e.g. software) are fine if they are strongly relevant to technology hardware. Another example would be business news for hardware-focused companies.
Please try and post original sources when possible (as opposed to summaries).
If posting an archived version of the article, please include a URL link to the original article in the body of the post.

Icon by “icon lauk” under CC BY 3.0

Visibility: Public

This community can be federated to other instances and be posted/commented in by their users.

39 users / day
562 users / week
1.55K users / month
5.14K users / 6 months
1 local subscriber
7.38K subscribers
1.68K Posts
6.67K Comments
Modlog